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Enhanced Patch Antenna Performance Using Two Layers Dielectric Superstrate in Probe-Edge-Inset and Aperture Feeding Methods

Hayat Errifi, Abdennaceur Baghdad, Abdelmajid Badri, and Aicha Sahel
EEA & TI Laboratory, FST, Mohammedia, Morocco
Abstract—Dielectric superstrate enhanced patch antennas could advantageously replace conventional array antenna in several application. This new technology simplifies the antenna configuration and can potentially lead to lighter and cost effective solutions. In this paper, the design of a microstrip patch antenna utilizing superstrate layers for performance enhancement is presented. The proposed antenna is excited by using the edge, inset, probe and aperture feeding methods. The double layer dielectric superstrate disposed above the patch antennas are used for enhancing the directivity and also for getting better return loss since microstrip antennas have limitations in directivity, gain and efficiency. The proposed antennas are simulated by using the Ansoft HFSS software. The characteristics of the edge, inset, probe and aperture feeding patch antennas covered by superstrate are obtained in terms of return loss, directivity, VSWR and radiation pattern and are compared with those of the same patch antennas without superstrate. We also carry out a parametric study of the distance between the lower and the higher superstrate, and examine how this separation distance affects the directivity and beam shaping of the composite structure. The return loss up to -47.06dB and directivity equal to 13.5dB are obtained at the center frequency of 8 GHz for the aperture coupled patch antenna through the use of the superstrate layers. This antenna is found to be suitable for X band applications.
 
Index Terms—patch antenna, HFSS, dielectric superstrate, return loss, directivity, radiation pattern

Cite: Hayat Errifi, Abdennaceur Baghdad, Abdelmajid Badri, and Aicha Sahel, "Enhanced Patch Antenna Performance Using Two Layers Dielectric Superstrate in Probe-Edge-Inset and Aperture Feeding Methods," International Journal of Signal Processing Systems, Vol. 4, No. 5, pp. 362-369, October 2016. doi: 10.18178/ijsps.4.5.362-369
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